Thin multilayer substrate
Features
.jpg?1149312944984) □ A multi-layer substrate with excellent high-frequency
characteristics.
□ Multi-layer substrate of the world's thinnest class
(10 layers 0.45 mmt).
□ Enabling all-layers random via connections, thus improving
the degree of freedom of designing.
□ Possible to use a bump connection method for board
space reduction.
Use
□ High-frequency PCB for ultra-high frequencies at 60 GHz or
higher
□ Thin PCB with high-frequency characteristics
□ Replacement of flex rigid PCBs
□ Replacement of Teflon PCBs and ceramic PCBs
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